Organic light emitting display device and method of manufacturing the same

ABSTRACT

An organic light emitting display device realizes slimness, having flexibility, and effectively reducing or preventing visibility of reflected external light, which includes an organic light emitting panel, a first adhesive layer on the organic light emitting panel, a touch electrode array being in contact with the first adhesive layer, a separation layer on the touch electrode array, and a cover film on the separation layer.

This application claims the benefit of Korean Patent Application No.10-2015-0126133, filed on Sep. 7, 2015, which is hereby incorporated byreference as if fully set forth herein.

BACKGROUND OF THE INVENTION

Field of the Invention

The present invention relates to a display device, and moreparticularly, to an organic light emitting display device having slimprofile and flexibility, and a method of manufacturing the same.

Discussion of the Related Art

Flat display devices include a liquid crystal display device (LCD), anorganic light emitting diode (OLED) device, a plasma display panel (PDP)device, a quantum dot display device, a field emission display (FED)device, an electrophoretic display (EPD) device, etc. Each of these flatdisplay devices typically includes a flat display panel for displayingan image in which a pair of transparent insulating substrates facingeach other are bonded to each other, with an intrinsic light emittinglayer, a polarizing layer or other optical material layers interposedtherebetween.

As the demand for a flat display element having a small space occupationis increasing in accordance with the recent trend of large-sized displaydevices, an organic light emitting display device is considered as thenext generation display device among these flat display devices. This isbecause the organic light emitting display device typically does notrequire a separate light source and a structure to assemble the lightsource to a display panel, and includes organic light emitting diodesspontaneously emitting light in the unit of pixels.

An organic light emitting diode typically comprises an anode, a cathodeand an organic layer between the anode and the cathode. The organiclight emitting diode emits light when pairs of electrons and holes,which are injected into the organic layer between an electron injectionelectrode (a cathode) and a hole injection electrode (an anode) and thenare recombined in the organic layer, are transitioned from an excitedstate to a ground state.

Meanwhile, a touch panel, which can recognize a touch point contacted bya human hand or other input unit, is recently added and attached to anexternal surface of a display device.

Touch panels are divided into a resistive type, a capacitive type, andan infrared sensing type. Presently, the capacitive type touch panel isadvantageous for small-sized display devices due to ease of fabricationand sensitivity.

Hereinafter, a conventional organic light emitting display device towhich a touch panel is attached will be described with reference to theaccompanying drawings.

FIG. 1 is a cross-sectional view illustrating a conventional organiclight emitting display device to which a touch panel is attached.

As shown in FIG. 1, the conventional organic light emitting displaydevice includes an organic light emitting display panel 10, a touchpanel 20 and a cover film 30 which are sequentially stacked. First andsecond adhesive layers 15 and 25 are provided between the light emittingdisplay panel 10 and the touch panel 20 and between the touch panel 20and the cover film 30, respectively.

Herein, the organic light emitting display panel 10 includes asubstrate, a thin film transistor array arranged on the substrate in amatrix, and organic light emitting diodes connected to respective thinfilm transistors of the thin film transistor array. An encapsulatingsubstrate sealing the organic emitting diodes and a polarizing layer arefurther provided. In this case, the first adhesive layer 15 is disposedon the polarizing layer. The touch panel 20 includes a plurality oftouch electrodes disposed on its touch substrate for detecting a user'stouch.

The substrate of the organic light emitting display panel 10, theencapsulating substrate, the touch substrate of the touch panel 20 andthe cover film 30 are typically formed of a hard material such as glass.These substrates typically have a thickness of about 0.5 mm or more, andthus, it may be difficult to manufacture an organic light emittingdisplay device to which a touch panel is attached with slim profile anddesired flexibility.

SUMMARY OF THE INVENTION

Accordingly, the present invention is directed to an organic lightemitting display device and a method of manufacturing the same thatsubstantially obviates one or more problems due to limitations anddisadvantages of the related art.

An advantage of the present invention is to provide an organic lightemitting display device having slimness and flexibility, and a method ofmanufacturing the same.

Additional advantages, objects, and features of the invention will beset forth in part in the description which follows and in part willbecome apparent to those having ordinary skill in the art uponexamination of the following or may be learned from practice of theinvention. The objectives and other advantages of the invention may berealized and attained by the structure particularly pointed out in thewritten description and claims hereof as well as the appended drawings.

To achieve these objects and other advantages and in accordance with thepurpose of the invention, as embodied and broadly described herein, anorganic light emitting display device, in which a plastic or glasssupport substrate used to form a touch electrode array is removed afterforming the touch electrode array, is provided. As a result, an entirethickness of the organic light emitting display device can be decreasedwhen the touch electrode array is disposed on an organic light emittingpanel. In addition, a material causing visibility of reflected externallight can be removed, thereby improving visibility of desired images.

In an aspect of the present invention, an organic light emitting displaydevice including an organic light emitting panel includes a thin filmtransistor array on a base substrate, an organic light emitting diodearray electrically connected to the thin transistor array, and anencapsulation layer covering the organic light emitting diode array, afirst adhesive layer on the organic light emitting panel, a touchelectrode array being in contact with the first adhesive layer, aseparation layer on the touch electrode array, and a cover film on theseparation layer.

The separation layer may have a thickness of 100 Å or less.

The separation layer may include a silicon material or a metal oxidelayer.

The organic light emitting display device may further include a barrierlayer in contact with the touch electrode array and a buffer layer incontact with the buffer layer, between the touch electrode array and theseparation layer.

The barrier layer may include an inorganic layer having a thickness of500 Å to 3,000 Å, and the buffer layer may include an organic layerhaving a thickness of 1 μm to 8 μm.

The barrier layer may include a single layer of an oxide layer or anitride layer, multi-layers of an oxide layer or a nitride layer, or analternately laminated layer of an oxide layer and a nitride layer.

The buffer layer may include at least one of an acrylic group, an epoxygroup, a polyimide group, and a polyamide group.

The cover film may include a circular polarizing plate.

The circular polarizing plate may be in contact with the separationlayer.

The organic light emitting display device may further include a secondadhesive layer between the separation layer and the cover film.

The separation layer and the cover film may be in contact with a lowersurface and an upper surface of the second adhesive layer, respectively.

The organic light emitting display device may further include a circularpolarizing plate between the second adhesive layer and the cover film.

The touch electrode array may include a plurality of first and secondtouch electrodes intersecting each other; a protective layer coveringthe first and second touch electrodes; a plurality of touch padelectrodes corresponding to the first and second electrodes at anoutside region of an active region, and a plurality of routing wirestransmitting signals to the first and second touch electrodes at thetouch pad electrodes, wherein, at least one of the first and secondtouch electrodes, the routing wires, and the touch pad electrodes may bein contact with the barrier layer, and the protective layer may be incontact with the first adhesive layer.

The organic light emitting display device may further include a lightshielding layer between the barrier layer and the protective layerwithin the touch electrode array, and the light shielding layerincluding a color filter layer and a black matrix layer staked.

In accordance with another aspect of the present invention, there isprovided a method of manufacturing an organic light emitting displaydevice including providing an organic light emitting panel comprising athin transistor array on a first base substrate, an organic lightemitting diode array electrically connected to the thin transistorarray, and an encapsulation layer covering the organic light emittingdiode array, forming a separation layer and a touch electrode array on asecond base substrate, attaching a first adhesive layer between theencapsulation layer and the touch electrode array which face each other,exposing the separation layer to remove the second base substrate, andattaching a cover film to the exposed separation layer through a secondadhesive layer.

Removing the second base substrate may include irradiating a laser.

Optionally, removing the separation layer to a certain thickness may beadded.

The remaining separation layer may have a thickness of 100 Å, or lessafter partially removing the separation layer.

Also, forming a buffer layer and a barrier layer on the separation layermay be added, after forming the separation layer and before forming thetouch electrode array.

The second base substrate may include a plastic substrate or a glasssubstrate, or a stacked structure of a plurality of plastic substrates.

In accordance with another aspect of the present invention, there isprovided a method of manufacturing an organic light emitting displaydevice including providing an organic light emitting panel including athin transistor array on a base substrate, an organic light emittingdiode array electrically connected to the thin transistor array, and anencapsulation layer covering the organic light emitting diode array,sequentially forming a separation layer, a buffer layer, a barrier layerand a touch electrode array on a glass substrate, attaching a firstadhesive layer between the encapsulation layer and the touch electrodearray, which face each other, removing the glass substrate and theseparation layer, and attaching a cover film to the exposed buffer layerthrough a second adhesive layer.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the invention and are incorporated in and constitute apart of this application, illustrate embodiment(s) of the invention andtogether with the description serve to explain the principle of theinvention. In the drawings:

FIG. 1 is a cross-sectional view illustrating a conventional organiclight emitting display device to which a touch panel is attached;

FIG. 2 is a cross-sectional view illustrating an example of an organiclight emitting display device employed as a flexible display;

FIG. 3 is a view illustrating an optical path of an external lightincident on the organic light emitting display device of FIG. 2;

FIG. 4 is a graph showing changes of birefringence depending on types ofmaterials and thicknesses of the second flexible substrate of FIG. 2;

FIG. 5 is a cross-sectional view illustrating an organic light emittingdisplay device according to an embodiment of the present invention;

FIG. 6 is a view illustrating an optical path of an external lightincident on the organic light emitting display device of FIG. 5;

FIGS. 7A to 7D are cross-sectional views illustrating a method ofremoving an upper base substrate of an organic light emitting displaydevice according to a first embodiment of the present invention;

FIGS. 8A and 8B are cross-sectional views illustrating a method ofremoving an upper base substrate of an organic light emitting displaydevice according to a second embodiment of the present invention;

FIGS. 9A to 9C are cross-sectional views illustrating a method ofremoving an upper base substrate of an organic light emitting displaydevice according to a third embodiment of the present invention;

FIG. 10 show pictures capturing an upper surface of FIG. 9C usingmeasurement equipment after removing the upper base substrate of theorganic light emitting display device through the method of FIGS. 9A to9C;

FIG. 11 is a graph measuring a laser energy density vs a Si ratio at theupper surface of FIG. 9C after removing the upper base substrate of theorganic light emitting display device through the method of FIGS. 9A to9C.

FIG. 12 is a cross-sectional view illustrating an organic light emittingdisplay device according to a first embodiment of the present invention;

FIG. 13 is a cross-sectional view specifically illustrating the organiclight emitting display device according to the first embodiment of thepresent invention;

FIG. 14 is a cross-sectional view illustrating an organic light emittingdisplay device according to a second embodiment of the presentinvention;

FIG. 15 is a cross-sectional view specifically illustrating the organiclight emitting display device according to the second embodiment of thepresent invention;

FIG. 16 is an SEM of the organic light emitting display device accordingto the second embodiment of the present invention;

FIG. 17 is a cross-sectional view illustrating an organic light emittingdisplay device according to a third embodiment of the present invention;

FIG. 18 show pictures of an organic light emitting display device whenan upper material is maintained and removed, as viewed from an upperside, a profile side and a front side; and

FIG. 19 is a graph illustrating reflectivity changes with respect towavelength changes when an upper material is maintained and removed.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

Reference will now be made in detail to embodiments of the invention,examples of which are illustrated in the accompanying drawings. Whereverpossible, the same reference numbers will be used throughout thedrawings to refer to the same or like parts. It will be paid attentionthat detailed description of known arts will be omitted if it isdetermined that the arts can mislead the embodiments of the invention.Names of components used in the following description may be selected inconsideration of facility of specification preparation. Thus, the namesof the components may be different from names of components used in areal product.

FIG. 2 is a cross-sectional view illustrating an example of an organiclight emitting display device as a flexible display. FIG. 3 is a viewillustrating an optical path of an external light incident on theorganic light emitting display device of FIG. 2.

Referring to FIG. 2, an organic light emitting display device accordingto an embodiment includes first and second plastic base substrates 41and 52, with which the substrate and the touch panel of the organiclight emitting display including the attached touch panel of FIG. 1 arereplaced, and a circular polarizing plate 60, with which the cover filmof FIG. 1 is replaced.

In this case, an organic light emitting display panel 40 disposed at alower side includes the first plastic base substrate 41, a thin filmtransistor array 42, an organic light emitting array 43, and anencapsulating layer 44, which are sequentially stacked from below. Atouch panel facing the organic light emitting display panel 40 includesthe second plastic base substrate 52, a touch electrode array 51disposed on the second plastic base substrate 52.

In addition, a first adhesive layer 45 is disposed between the organiclight emitting display panel 40 and the touch panel 50. A secondadhesive layer 55 is disposed between the touch panel 50 and thecircular polarizing plate 60.

In this case, a polarizing plate is omitted in the organic lightemitting display panel 40. The circular polarizing plate 60 is disposedat the outmost side to reduce or prevent a reflection of external lightwhile protecting a surface of the device.

As compared to the organic light emitting display device according tothe related art, the thick glass material is replaced with the plasticsubstrates 41 and 52 and the circular polarizing plate 60 having athickness of 25 μm or lower, and, as such, the thickness of the entiredevice can be decreased and the flexibility of the device can beincreased.

Meanwhile, when the thin film transistor array 42 and the touchelectrode array 52 are formed on the thin first and second plasticsubstrates 41 and 52, the first and second plastic substrates 41 and 52can be rolled. To this end, a support substrate such as a glasssubstrate is disposed on each of the lower sides of the first and secondplastic substrates 41 and 52 to support the first and second plasticsubstrates 41 and 52. After completing an array process and an bondingprocess in which the organic light emitting light panel 40 is attachedto the touch panel 50, the support substrates may be removed.

The organic light emitting display device of FIG. 2 has an advantage inflexibility, but may have a reflective element in response to anexternal light, which will now be described in detail.

Referring to FIG. 3, after an external light is incident on the circularpolarizing plate 60 along a certain axis, the circularly polarized lightthen passes through the second adhesive layer 55, the touch panel 50,the first adhesive layer 45, and the organic light emitting displaypanel 40. Herein, an optical path of the circular polarized lightchanges due to a birefringence at the second plastic substrate 52 of thetouch panel 50. In this case, after the circularly polarized light isreflected from a reflection electrode of the organic light emittingarray 43 in the organic light emitting display panel 40, the reflectedlight reaches the circular polarizing plate 60 through the firstadhesive layer 45, the touch panel 50, and the second adhesive layer 55.Herein, the reflected light includes an element crossing the certainaxis of the circular polarizing plate 60 and an element twisted by thebirefringence of the second plastic substrate 52, which may result in alight leakage.

Hereinafter, in consideration of the principle of FIG. 3, changes ofbirefringence of the second flexible substrate 52 will be measured anddiscussed depending on materials and thicknesses employed.

FIG. 4 is a graph showing changes of birefringence depending on types ofmaterials and thicknesses of the second flexible substrate 52 of FIG. 2.

The second plastic substrate 52, as tested in FIG. 4, is a transparentpolyimide group film. The second plastic substrate 52 has materials A toD which are different from one another. However, FIG. 4 shows thatregardless of the material A to D employed, as the thickness of thesecond plastic substrate 52 increases, the birefringence thereofincreases. In addition, the visibility of the reflected light increasesin proportion to an amount of birefringence of the second flexiblesubstrate 52.

When the second plastic substrate 52 has a thickness of about 5 μm to 20μm, an amount of birefringence Rth is greater than 40 nm for all thematerials of the second plastic substrates 52, namely, A to D. In thiscase, although the circular polarizing plate 60 for birefringence isprovided, it may not be easy to reduce or prevent reflection of externallight due to the birefringence of the second plastic substrate 52, whichis used for a slim profile design of the organic light emitting displaydevice.

To reduce or prevent the visibility of the reflected light caused by thebirefringence of the second plastic substrate 52, an opticalcompensation film such as a C+ plate may be further provided tocompensate for the birefringence of the second plastic substrate 52.However, since the optical compensation film typically has a thickness150 μm or more, there may be a disadvantage in flexibility.

Hereinafter, an organic light emitting display device according to anembodiment will be described, which does not include an opticalcompensation film for slimness and flexibility. However, the presentinvention is not limited thereto, and an organic light emitting displaydevice according to an embodiment of the present invention may includean optical compensation film.

FIG. 5 is a cross-sectional view illustrating an organic light emittingdisplay device according to an embodiment of the present invention. FIG.6 is a view illustrating an optical path of an external light incidenton the organic light emitting display device of FIG. 5.

Referring to FIGS. 5 and 6, the organic light emitting display deviceincludes an organic light emitting panel 1000 including a thin filmtransistor array 110 disposed on a first plastic base substrate 100, anorganic light emitting diode array 120 electrically connected to thethin film transistor array 110, and an encapsulation layer 130 coveringthe organic light emitting diode array 120, a first adhesive layer 140disposed on the organic light emitting panel 1000, a touch electrodearray 150 contacting the first adhesive layer 140, a separation layer225 disposed on the touch electrode array 150, and a cover film 160disposed on the separation layer 225.

The separation layer 225 has a thickness of 100 Å or less. After asecond plastic base substrate 210 (see FIG. 7A) is removed, theseparation layer 225 is exposed. Namely, during a manufacture of thetouch electrode array 150 using deposition and patterning processes, thesecond plastic base substrate 210 is maintained at a bottom side of theseparation layer 225. Then, after bonding the touch electrode array 150to the organic light emitting panel 1000, the second plastic basesubstrate 210 is removed. As a result, the visibility of external lightdue to the birefringence of the second plastic base substrate 210 can bereduced or prevented.

A surface of the separation layer 225 may not be flat. The separationlayer 225 may have a non-uniform surface according to contained elementsthereof. Alternatively, a part of the separation layer 225 may beremoved at an upper surface of the touch electrode array 150 and theother part of the separation layer 225 may remain at the upper surfaceof the touch electrode array 150.

Herein, the separation layer 225 may be formed of a single element suchas amorphous silicon, or a silicon group compound such as siliconnitride (SiN_(x)) and/or silicon oxide (SiO_(x)). The separation layer225 may be a metal oxide layer formed of Al₂O₃, MO_(x) and/or TiO₂.

Furthermore, the separation layer 225 functions to protect the touchelectrode array 150 when the second plastic base substrate 210 disposedat the upper side of the touch electrode array 150 is removed afterbonding the organic light emitting panel 1000 and the touch electrodearray 150. Upon removal of the second plastic base substrate 210, a partof the separation layer 225 adjacent to the second plastic basesubstrate 210 may be removed. The separation layer 225 is provided toreduce or prevent damage such as corrosion or oxidation of a metallictouch electrode when the touch electrode array 150 is directly exposed.

The second plastic base substrate 210 may be removed by a laserreleasing process. At the same time, the silicon group material or metaloxide, namely, elements of the separation layer 225 which is adjacent tothe second plastic base substrate 210 is partially removed.

Meanwhile, the encapsulation layer 130 may be a face seal or a barrierstack structure composed of alternately laminated inorganic and organiclayers, in order to cover the organic light emitting diode array 120.

The cover film 160 may basically include a circular polarizing plate.The cover film 160 may be a circular polarizing plate itself. In thiscase, the cover film may be directly coated on an exposed surface of theseparation layer 225, or may be added with a separate circularpolarizing plate film in an attached manner. In the former case, a phasedelay layer and a linear polarizing layer are formed on the surface ofthe separation layer 225 to form the cover film 160. In the latter case,forming the cover film 160 includes preparing a circular polarizingplate having a film type, and directly laminating an adhesive surface ofthe circular polarizing plate on the separation layer 225 while aprotection surface of the circular polarizing plate is exposed.Furthermore, in the case that the cover film 160 is a single circularpolarizing plate, the circular polarizing plate functions to protect theorganic light emitting display device from external impact. The coverfilm 160 has a thickness of 10 μm to 80 μm, which may be sufficient toflex the organic light emitting display device, emit light from theorganic light emitting diode array 120 disposed below and reduce orprevent reflection of external light.

Alternatively, the cover film 160 may have a double-layered structureincluding a circular polarizing plate and a cover film. In this case,the cover film is disposed at outside corresponding to a viewed surface.The cover film is beneficially formed of a soft transparent film, not ahard material such as a glass. For example, the cover film may be formedof one selected from the group including a polyethylene group resin, apolypropylene group resin, a polyethylene terephthalate group resin, apolyvinyl alcohol group resin, a nylon group resin, a polyacrylonitrilegroup resin, and a polymethacrylic acid group resin. In this case, thecover film is disposed on a surface of the organic light emittingdisplay device to protect the device from external impact. The circularpolarizing plate disposed below the cover film optically functions toreduce or prevent visibility of external light.

When the cover film 160 includes a circular polarizing plate, asillustrated in FIG. 6, unpolarized external light passes through thecircular polarizing plate 160 to be right-circularly polarized withrespect to a transmission axis and is incident upon the touch electrodearray 150, the adhesive layer 140, the encapsulation layer 130 and theorganic light emitting diode array 120. The incident light is reflectedby a reflection electrode included in the organic light emitting diodearray 120 to be left-circularly polarized. In this case, the reflectedlight is thus oriented along an absorption axis crossing thetransmission axis of the circular polarizing plate, and, as such, thereflected light is reduced or prevented as it does not pass though thecircular polarizing plate 160.

Accordingly, the organic light emitting display device as illustrated inFIG. 5 according to an embodiment of the present invention can reduce orprevent visibility of external light. In such a structure, theseparation layer 225 contacting the touch electrode array 150 betweenthe touch electrode array 150 and the cover film 160 has a thickness of0.01 μm (=100 Å) or less, thereby reducing or preventing movement of thetransmission axis. A movement of the transmission axis may occur when anincident light passes through a plastic film before or after reflectionafter an external light is incident upon the circular polarizing plate160 in the organic light emitting display device. In addition, when thelight is reflected by the reflection electrode of the organic lightemitting diode array 120, the reflected light may be blocked by theabsorption axis of the circular polarizing plate 160.

Hereinafter, a method of manufacturing an organic light emitting displaydevice according to an embodiment of the present invention will bedescribed in which a removal process of an upper base substrate such asa second plastic base substrate and/or a second glass substrate isemployed.

FIGS. 7A to 7D are cross-sectional views illustrating a method ofremoving an upper base substrate of an organic light emitting displaydevice according to a first embodiment of the present invention.

As illustrated in FIG. 5 Å, a method of manufacturing an organic lightemitting display device according to an embodiment of the presentinvention includes forming the organic light emitting panel 1000including the thin film transistor array 110 disposed on the firstplastic base substrate 100, the organic light emitting diode array 120connected to the thin film transistor array 110, and the encapsulationlayer 130 covering the organic light emitting diode array 120. In thisprocess, when the first plastic base substrate 100 has process tolerancesufficient to endure impact such as sputtering and a high temperatureprocess such as crystallization, the thin film transistor array 110 canbe directly formed thereon. If not, a first glass substrate 250 isprovided below the first plastic base substrate 100, as illustrated inFIG. 7A, the thin film transistor array 110 and the organic lightemitting diode array 120 can be formed and then the encapsulation layer130 may be formed to cover an upper surface of the organic lightemitting diode array 120 and a periphery thereof.

Sequentially, as illustrated in FIG. 7A, a surface to be formed with thetouch electrode array 150 may be the second plastic base substrate 210.However, before forming the touch electrode array 150, the separationlayer 225 is provided to protect the touch electrode array 150 duringremoval of the second plastic base substrate 210. The separation layer225 is an inorganic layer having a thickness of 0.01 μm (=100 Å) orless. The separation layer 225 may be formed of a silicon group materialor may be a metal oxide layer. When the thickness of the separationlayer 225 is greater than 0.01 μm, a part of the separation layer 225may be removed by adjusting laser energy density in laser releasingduring removal of the second plastic base substrate 210 of FIG. 7D,which will be described later. Furthermore, a second glass substrate 200may be further provided below the second plastic base substrate 210 and,as such, the second plastic base substrate 210 may be sufficientlysupported during formation of the first and second touch electrodesusing a sputtering process.

Sequentially, the encapsulation layer 130 and the touch electrode array150 are positioned to face each other, the first adhesive layer 140 (seeFIG. 5) is interposed therebetween, and the encapsulation layer 130 andthe touch electrode array 150 are bonded to one another.

Meanwhile, each of the first and second glass substrates 250 and 200 hasa thickness of 0.5 mm or more. This increases the thickness of thedevice, thereby decreasing the flexibility of the device. As such, thefirst and second glass substrates 250 and 200 are removed. First, thesecond glass substrate 200 is removed, and then the first glasssubstrate 250 is removed. This will be described later.

As illustrated in FIGS. 7B and 7C, the second glass substrate 200 isfirst released and removed by irradiating a laser as illustrated in FIG.7C.

In succession, as illustrated in FIG. 7D, the exposed second plasticbase substrate 210 is removed up to the separation layer 225 as aboundary. The second plastic base substrate 210 is thin and transparent,and thus, the separation layer 225 may be stripped by raising a cornerthereof.

After the second glass substrate 200 and the second plastic basesubstrate 210 are removed, the first glass substrate 250 disposedtherebelow is removed using a laser, although not shown.

Meanwhile, an element of the removed second plastic base substrate 210may include a polymer compound. The element may include at least oneselected from the group consisting of polyester, copolymer includingpolyester, polyimide, copolymer including polyimide, olefin groupcopolymer, polyacrylic acid, copolymer including polyacrylic acid,polystyrene, copolymer including polystyrene, polysulfate, copolymerincluding polysulfate, polycarbonate, copolymer including polycarbonate,polyamic acid, copolymer including polyamic acid, polyamine, copolymerincluding polyamic acid, polyvinyl alcohol, polyallylamine. The removedsecond plastic base substrate 210 may have a thickness of about 20 μm to100 μm.

FIGS. 8A and 8B are cross-sectional views illustrating a method ofremoving an upper base substrate of an organic light emitting displaydevice according to a second embodiment of the present invention.

In the second embodiment, the second plastic base substrate 210 asillustrated in FIG. 8A is directly irradiated by a laser. As illustratedin FIG. 8B, the second plastic base substrate 210 may be stripped byraising it from the separation layer 225.

After removal of the second plastic base substrate 210, because theseparation layer 225 is very thin and transparent, the touch electrodearray 150 may be visible through the naked eye.

FIGS. 9A to 9C are cross-sectional views illustrating a method ofremoving an upper base substrate of an organic light emitting displaydevice according to a third embodiment of the present invention.

In the third embodiment, the method of removing the upper base substrateof the organic light emitting display device, as illustrated in FIG. 9A,includes sequentially forming a sacrificial layer 220 directly disposedon the second glass substrate 200, a buffer layer 170, and a barrierlayer 165 without the second plastic base substrate 210, and forming thetouch electrode array 150. Since the second plastic base substrate 210is not used, the buffer layer 170 and the barrier layer 165 may befurther provided to protect the touch electrode array 150.

A removal process will be described in detail. The sacrificial layer 220is formed of amorphous silicon, a silicon dielectric layer or a metaloxide layer. The buffer layer 170 is an organic layer having a thicknessof 1 μm to 8 μm. The barrier layer 165 is an inorganic layer having athickness of 500 Å to 3,000 Å. In this case, when the touch electrodearray 150 is formed, at least one of the electrodes of the touchelectrode array 150 is formed to directly contact the barrier layer 165.

In addition, in the state that such a structure is maintained, the firstglass substrate 250 may be bonded to the organic light emitting displaydevice 1000 having the above structure.

In this case, as illustrated in FIG. 9B, the second glass substrate 200is irradiated with a laser. As illustrated in FIG. 9C, the second glasssubstrate 200 and a part 220 a of the sacrificial layer 220 are removed.During the removal process, as illustrated in FIG. 9C, a part of thesacrificial layer 220 may remain at the separation layer 225. Thethickness of separation layer 225, as described above, may be 100 Å orless.

In addition, since the separation layer 225 is very thin, the separationlayer 225 may not have a flat surface. One region of the separationlayer 225 may be removed to expose the buffer layer 170, and the otherregion may remain to have a thin thickness.

Meanwhile, in a process of FIG. 9C, the separation layer 225 may becompletely removed. In this case, during removal of the separation layer225, a part of the buffer layer 170 may be removed and exposed. In thisprocess, the buffer layer 170 functions to protect against physicalimpact such as radiation of laser.

In the third embodiment, since the plastic base substrate on the touchelectrode array 150, which generates birefringence, is omitted, the sameeffect as removal of the second plastic base substrate in the first andsecond embodiments may be obtained.

Furthermore, after removal of the upper base substrate of the first tothird embodiments as described above, the first glass substrate 250disposed below may be removed using a laser. The removal process of thefirst glass substrate 250 is similar to the removal process of thesecond glass substrate or the second plastic base substrate.

Meanwhile, after the separation layer 225 is exposed by removal of thesecond plastic base substrate 210 and/or the second glass substrate 200,a second adhesive layer 320 (see FIG. 10) may be disposed on the exposedseparation layer 225 and the cover film 160 may be attached to theseparation layer 225.

Hereinafter, effectiveness of a method of manufacturing an organic lightemitting display device according to an embodiment of the presentinvention will be described through composition analysis of a picture,which captures an exposed upper surface after removal of the secondglass substrate or the second plastic base substrate used as a supportsubstrate or a formation substrate of the touch electrode array in theorganic light emitting display device.

FIG. 10 show pictures capturing the upper surface of FIG. 9C using ameasurement equipment after removing the upper base substrate of theorganic light emitting display device through the method of FIGS. 9A to9C. FIG. 11 is a graph measuring a laser energy density vs a Si ratio atthe upper surface of FIG. 9C after removing the upper base substrate ofthe organic light emitting display device through the method of FIGS. 9Ato 9C.

In particular, FIG. 10 are image pictures of the composition of theexposed upper surface of the separation layer 225 after removal of thesecond plastic base substrate 210 and/or the second glass substrate 200using a time of flight secondary mass spectrometer (ToF-SIMS).

In FIG. 10, the separation layer having a thickness of 100 Å is testedtwice when each laser energy density is 220 mJ/cm and 180 mJ/cm. Resultsof the laser energy density of 220 mJ/cm are referred as to #1 and #2,and results of the laser energy density of 180 mJ/cm are referred as to#3 and #4. In addition, FIG. 10 shows the composition of the measuredelements. As the brightness of the image picture increases, an amount ofthe element increases. In other words, as the color of the image pictureis gradually close to black, the amount of the element becomes smaller.

Herein, during removal of the upper base substrate, when the separationlayer is very thin, the buffer layer is exposed by the partially removedseparation layer. H, CH, and O are elements of the exposed buffer layer.

In addition, a single element such as Si or a silicon compound bonded tohydrogen such as SiH is an element of the separation layer.

Under the condition of #1 to #4, Si or SiH, namely, the element of theseparation layer, is about 0.01% to 0.2% (169/967,379) in comparisonwith H, CH, or O, namely, the element of the buffer layer. It is notedthat the amount of the element of the remaining separation layer is verysmall. Thus, this is not optically or electrically influenced to theother devices in the organic light emitting display device.

FIG. 11 illustrates composition between C—H (a main element of thebuffer layer) versus Si (a main element of the separation layer) in thecase of the separation layer having a thickness of 200 Å and in the caseof the separation layer having a thickness of 500 Å. In the case of thethickness of 200 Å, the separation layer contains 0.1% Si. In the caseof the thickness of 500 Å, the separation layer contains 1% Si. It isnoted that the remaining amount of Si is proportional to the thicknessof the separation layer.

The separation layer according to an embodiment of present invention isan inserted layer for removing the upper base substrate of the touchelectrode array. In other words, the separation layer is not an opticalor electrical layer in the device. Accordingly, the thickness of theseparation layer is beneficially 100 Å or less to not influence theother functional layers in the device.

In addition, when the separation layer is formed of silicon or is ametal oxide layer, the separation layer may have semiconductive orconductive characteristics. Alternatively, the separation layer may becompletely removed to drive a sensitive touch electrode array. In thiscase, although the separation layer is removed, the touch electrodearray should be not exposed. To do so, as illustrated in FIG. 9A, thebarrier layer 165 and the buffer layer 170 are provided on the touchelectrode array 150 to protect the touch electrode array 150 fromexternal physical stress due to removal of the separation layer.

Hereinafter, various embodiments of an organic light emitting displaydevice will be described. The organic light emitting display devicewhich includes the structure of FIG. 5 as the basic structure may bemodified in the following various embodiments.

FIG. 12 is a cross-sectional view illustrating an organic light emittingdisplay device according to a first embodiment of the present invention.FIG. 13 is a cross-sectional view specifically illustrating the organiclight emitting display device according to the first embodiment of thepresent invention.

As illustrated in FIG. 12, the organic light emitting display deviceaccording to the first embodiment of the present invention includes anorganic light emitting panel 1000 including a thin film transistor array110 disposed on a first plastic base substrate 100, an organic lightemitting diode array 120 electrically connected to the thin filmtransistor array 110, and an encapsulation layer 130 covering theorganic light emitting diode array 120, a first adhesive layer 140disposed on the organic light emitting panel 1000, a touch electrodearray 150 contacting the first adhesive layer 140, a barrier layer 165,a buffer layer 170 and a separation layer 225 sequentially disposed onthe touch electrode array 150, and a cover film 160 disposed on theseparation layer 225.

Herein, before bonding the organic light emitting panel 1000 and thetouch electrode array 150, the separation layer 225, the buffer layer170, and the barrier layer 165 are from upside sequentially formed on asecond glass substrate 200 (see, FIG. 7A) or a second plastic basesubstrate 210. After removal of the second glass substrate 200 and thesecond plastic base substrate 210, in the state that the separationlayer 225 is exposed, the cover film 160 is attached to the separationlayer 225 through a second adhesive layer 160. In this case, the secondadhesive layer 160 is disposed between the separation layer 225 and thecover film 160 such that the separation layer 225 and the cover film 160are in contact with an upper surface and a lower surface of the secondadhesive layer 320, respectively.

A difference from the basic structure of FIG. 5 is the addition of thebuffer layer 170 and the barrier layer 165 to protect the touchelectrode array 150.

The barrier layer 165 is an inorganic layer having a thickness of 500 Åto 3000 Å. The buffer layer is an organic layer having a thickness of 1μm to 8 μm. The organic buffer layer acting as a buffer against physicalstress such as a laser is adjacent to the separation layer 225.Furthermore, the barrier layer 165 directly contacts the touch electrodearray 150. The barrier layer 165 functions to reduce or prevent a touchelectrode, a routing wire, or a touch pad electrode from being directlyexposed during a removal process of the second plastic base substrate orthe second glass substrate. The barrier layer 165 may be formed of thesame material as an insulation layer constituting the touch electrodearray.

In detail, the buffer layer 170 may include an organic layer formed ofat least one of acrylic group, epoxy group, polyimide group, andpolyamide. The barrier layer 165 may include a single layer such as anoxide layer or a nitride layer, or multiple layers of an oxide layer ora nitride layer, or alternately laminated layers of an oxide layer and anitride layer. The buffer layer 170 and the barrier layer 165 aretransparent and have a reflectivity of 5% or less. As a result, thebuffer layer 170 and the barrier layer 165 may direct the light emittedfrom the organic light emitting diode array 120 without loss. As thebuffer layer 170 has a thickness range from 1 μm to 8 μm, there may beno birefringence upon introduction of external light. Even if there isbirefringence, an amount of birefringence may be maintained at aninvisible level.

Meanwhile, according to the first embodiment, the cover film 160 is acircular polarizing plate itself. When an unpolarized external light isincident along a certain transmission axis of the circular polarizingplate, the light is left-circularly polarized or right-circularlypolarized. Then, when the light is reflected at the first electrode 121(FIG. 13) of a reflective electrode element of the organic lightemitting diode array 120, the light is right-circularly polarized orleft-circularly polarized to proceed to the circular polarizing plate inan opposite direction. Herein, the reflected light is blocked by theabsorption axis to reduce or prevent reflection of external light.

In detail, internal constituents of the organic light emitting displaydevice according to the first embodiment of the present invention inFIG. 13 will now be described.

As illustrated in FIG. 13, a TFT buffer layer 105 including a pluralityof inorganic layers may be further provided on the first plastic basesubstrate 100. When wiring or an active layer is directly formed on thefirst plastic base substrate 100, the TFT buffer layer 105 allows asurface of the wiring or active layer to be uniform.

The thin transistor array 110, the organic light emitting diode array120, and the touch electrode array 150 in an active region are disposedat the same level as the thin transistor array 110, the organic lightemitting diode array 120, and the touch electrode array 150 in aperipheral region. In addition, in a planar view, a plurality of pixelsare arranged in a matrix in the active region. Each thin transistorarray 110 includes gate lines and data lines, which cross each other. Inthis case, each pixel is disposed at every crossing point and includesat least one thin film transistor (TFT). The organic light emittingdiode array 120 includes organic light emitting diodes (OLEDs). Thetouch electrode array 150 includes first touch electrodes 151 and secondtouch electrodes 152, which cross each other. The crossing point of thefirst and second touch electrodes 151 and 152 may correspond to eachpixel. Alternatively, an arrangement of the first and second touchelectrodes 151 and 152 may be unrelated to an arrangement of the pixels.

Furthermore, a pad part is disposed in a peripheral region of the thintransistor array 110. The touch electrode array 150 includes a touch padpart partially connected to the pad part of the thin film transistorarray 110. Herein, since the pad part of the thin film transistor array110 is connected to the touch pad part, a separate a flexible printedcircuit (FPC) connection may not be needed at the touch electrode array150 side to receive a touch control signal from the thin transistorarray 110. As a result, the manufacturing process may be simplified andthe FPC connection may be minimized.

The thin transistor (TFT) in the pixel of the thin pixel transistorarray 110 includes an active layer 111 on the TFT buffer layer 105, agate dielectric layer 112 covering the active layer 111 while beingformed on the TFT buffer layer 105, a gate electrode 113 overlapping theactive layer 111, an interlayer dielectric 114 formed on the gateelectrode 113 and the gate dielectric layer 112, and a source electrode115 and a drain electrode 116 passing through the interlayer dielectric114 and the gate dielectric layer 112 to connect both ends of the activelayer 112, respectively. Herein, the gate electrode 113 may be disposedat the same level as the gate line. The source electrode 115 and thedrain electrode 116 may be disposed at the same level as the data line.

Pad electrodes for the gate line and the data line and a secondelectrode pad electrode grounding the second electrode of the organiclight emitting diode array or applying a uniform voltage thereto areprovided in the peripheral region of the thin film transistor array.Furthermore, as illustrated, a touch auxiliary electrode 117 connectedto the touch pad electrode 155 of an upper surface of the touch padelectrode array 150 may be further provided.

The organic light emitting diode (OLED) includes a first electrodeconnected to the drain electrode 116, an organic light emitting layer123 formed in a bank 122 a defining a light emitting region, and asecond electrode 124 covering the organic light emitting layer 123.

Optionally, spacers 112 b having a certain thickness corresponding to awidth of the bank 112 a may be provided on the bank 122 a. When theorganic light emitting layer 123 is formed, organic material is disposedat the first plastic base substrate 100 using a metal mask having anopening. In this case, the metal mask droops such that the bank 122 acollapses or the light emitting region is influenced to an inner theemitting region. To this end, the spacers 112 b are regularly providedon the bank 112 a. Meanwhile, the first electrode is a reflectionelectrode and the second electrode 124 is a transparent electrode. Theexternal light is reflected at the first electrode 121 after passingthrough the organic light emitting diode (OLED). Then, the reflectedlight proceeds through the transparent second electrode 124.

In addition, the encapsulation layer 130 is formed on the organic lightemitting diode array 120 to cover the upper side and the profile side ofthe organic light emitting diode (OLED).

The touch electrode array 150 includes the first and second touchelectrodes 151 and 152 which cross each other in the active region, aprotective layer 156 covering the first and second touch electrodes 151and 152, a plurality of touch pad electrodes 155 corresponding to thefirst and second touch electrodes 151 and 152 in the peripheral region,and a routing wire 154 transferring signals from the touch padelectrodes 155 to the first and second touch electrodes 151 and 152.

In the illustrated embodiment, the first and second touch electrodes 151and 152, the routing wire 154, and the touch pad electrodes 155 includemetal mash patterns 151 a, 152 a, 154 a, and 155 a disposed at an upperside and transparent electrodes 151 b, 152 b, 154 b, and 155 b disposedat a lower side, respectively. Each of the first and second touchelectrodes 151 and 152, the routing wire 154, and the touch padelectrodes 155 has a double-layered electrode structure, therebyrealizing a stable electric field and low resistance. However, thepresent invention is not limited by such an electrode structureincluding the metal mash patterns. An organic light emitting displaydevice according to an embodiment of the present invention may include asingle-layer electrode structure.

Furthermore, since the first touch electrodes 151 and the second touchelectrodes 152 are disposed at the same level in order to reduce orprevent a short circuit between the first and second touch electrodes151 and 152, the first touch electrodes are connected to each other by abridge pattern 151 c disposed through a contact hole in the protectivelayer 140. As a result, the first touch electrodes 151 are electricallyisolated from the second touch electrodes 152.

As illustrated in FIG. 13, the first and second touch electrodes 151 and152, the routing wire 154, and the touch pad electrodes 155 are incontact with the barrier layer 165. The protective layer 156 may be incontact with the first adhesive layer 140 for bonding the encapsulationlayer 130 and the touch electrode array 150.

The barrier layer 165 is in contact with the organic buffer layer 170.The buffer layer 170 is in contact with the separation layer 225 formedof a silicon material or a metal oxide layer. The cover film 160functioning as a circular polarizing plate is attached to the separationlayer 225. The second adhesive layer 320 may be disposed between thecover film 160 and the separation layer 225 or be omitted. In the lattercase, the circular polarizing plate includes an adhesive surfacecorresponding to a surface of the separation layer 225.

Meanwhile, in the peripheral region, a seal material 272 including aconductive bead is provided. The conductive bead is disposed at a partcorresponding to the touch auxiliary pad electrode 117 to be verticallyconnected between the touch pad electrode 154 and the touch auxiliarypad electrode 117.

In addition, the first plastic base substrate 100 may be formed of apolymer compound. The first plastic base substrate 100 may include atleast one selected from the group including polyester, copolymerincluding polyester, polyimide, copolymer including polyimide, olefingroup copolymer, polyacrylic acid, copolymer including polyacrylic acid,polystyrene, copolymer including polystyrene, polysulfate, copolymerincluding polysulfate, polycarbonate, copolymer including polycarbonate,polyamic acid, copolymer including polyamic acid, polyamine, copolymerincluding polyamic acid, polyvinyl alcohol, polyallylamine. The firstplastic base substrate has relatively a high heat-resisting property incomparison with the second plastic base substrate 210. The first plasticbase substrate 100 may have a thickness of 5 μm to 100 μm.

In addition, a back cover film 190 is further provided below the firstplastic base substrate 100 to protect the first plastic base substrate100. The back cover film 190 is thicker than the plastic base substrate100 and has a higher hardness than the plastic base substrate 100.

FIG. 14 is a cross-sectional view illustrating an organic light emittingdisplay device according to a second embodiment of the presentinvention. FIG. 15 is a cross-sectional view specifically illustratingthe organic light emitting display device according to the secondembodiment of the present invention. FIG. 16 is an SEM of the organiclight emitting display device according to the second embodiment of thepresent invention.

As illustrated in FIGS. 14 and 15, the organic light emitting displaydevice according to the second embodiment of the present inventionincludes an external light shielding pattern 159 including a colorfilter layer 159 a and a black matrix layer 159 b disposed at the touchelectrode array 150 side, rather than the circular polarizing platedisposed at an outmost side in comparison with the first embodiment. Asa result, visibility of external light can be reduced or prevented. Inthis case, the external light shielding pattern 159 is disposed at anentire active region and a part of the peripheral region excluding thetouch pad part. A cover film 230 is provided to protect the outsidesurface of the device. The cover film 230 may be a transparentprotective film. Herein, the color filter layer 159 a may include a redcolor filter, a green color filter, and a blue color filter according todesired colors of the organic light emitting layer of the organic lightemitting diode array 120.

Meanwhile, in the second embodiment of the present invention, therouting wire 154 and the pad electrode 155 are in contact with thebarrier layer 165. The external light shielding pattern 159 is insertedbetween the first and second touch electrodes 151 and 152 and thebarrier layer 165. Such a disposition of the external light shieldingpattern 159 is merely an example. The first and second touch electrodes151 and 152 may be in contact with the barrier layer 165, and theexternal light shielding pattern 159 may be disposed farther from thebarrier layer 165. The color filter 159 a and the black matrix layer 159b of the external light shielding pattern 159 may be dividedly disposedat different layers in an inserted manner, similar to the disposition ofthe first and second touch electrodes 151 and 152.

Elements in FIG. 15 of the same reference numerals used in FIG. 13 havethe identical functions. As such, the duplicative description thereofwill be omitted.

FIG. 16 shows the exposed separation layer 225 after removal of theupper base substrate in the organic light emitting display deviceaccording to the second embodiment of the invention. The real separationlayer 225 has a thickness of 1/50 to 1/20 as thin as the buffer layer170 or the color filter layer 159 a of the touch electrode array 150.The upper base substrate is removed up to the separation layer 225 usedas a boundary, thereby protecting the touch electrode array 150.

In the second embodiment, the upper base substrate is removed to reduceor prevent birefringence caused by the upper base substrate. As aresult, visibility of external light is decreased, and opticalcharacteristics may be improved. Since a total thickness of the deviceis reduced by, for example, 20 μm to 100 μm due to removal of the upperbase substrate, the organic light emitting display device can have aslimmer profile.

FIG. 17 is a cross-sectional view illustrating an organic light emittingdisplay device according to a third embodiment of the present invention.

As illustrated in FIG. 17, the organic light emitting panel 1000, thefirst adhesive 140, and the touch electrode array 150 as described inthe first embodiment are employed to the organic light emitting displaydevice according to the third embodiment of the present invention. Thebarrier layer 165, the buffer layer 170, and the separation layer 225are sequentially provided on the touch electrode array 150 and acircular polarizing plate 1600 and the cover film 230 are sequentiallyprovided on the separation layer 225.

The circular polarizing plate 1600, as described above, has a functionof reducing or preventing visibility of external light. The circularpolarizing plate 1600 may be formed by attaching a film or bysequentially coating a phase delay layer and a linear polarizing layer.

The cover film 230 is a flexible transparent film and has a function ofprotection of a surface of the device from the outside. For example, thecover film 230 may be selected from the group including a polyethylenegroup resin, a polypropylene group resin, a polyethylene terephthalategroup resin, a polyvinyl alcohol group resin, a nylon group resin, apolyacrylonitrile group resin, and a polymethacrylic acid group resin.

FIG. 18 show pictures of an organic light emitting display device withor without an upper base substrate, as viewed from an upper side, aprofile side and a front side.

As illustrated in FIG. 18, when the second plastic base substrate usedas a formation surface of the touch electrode array is maintained, thereflected light may be visible at a black state. When the second plasticbase substrate or the second glass substrate is removed according toembodiments of the present invention, reflection of external light,which can be seen by an observer, can be reduced or prevented.

FIG. 19 is a graph illustrating reflectivity changes with respect towavelength changes when an upper material is maintained and removed.

As shown in FIG. 19, between 400 nm to 700 nm, that is, wavelengths ofvisible light, there is a difference of reflectivity depending whetherthe upper base substrate is removed or not. Particularly, in a redwavelength, the reflectivity difference is large. When the upper basesubstrate is maintained, reflectivity is high at a specific wavelength.As a result, reflection of external light may be visible by theobserver. According to an embodiment of the present invention,reflectivity is 4% or less in entire wavelengths of the visible lightdue to removal of the upper base substrate, and, as such, the observerrecognizes little or no reflection of external light.

As is apparent from the above description, there are the followingadvantages according to an embodiment of the present invention.

First, an organic light emitting display device includes a circularpolarizing plate. When an unpolarized external light is incident along acertain transmission axis of the circular polarizing plate, the light isleft-circularly polarized or right-circularly polarized. Then, the lightis reflected to be right-circularly polarized or left-circularlypolarized in an opposite direction. Herein, the reflected light isblocked by an absorption axis of the circular polarizing plate to reduceor prevent visibility of external light. Plastic base substrates of theorganic emitting panel disposed at below and the touch panel disposed atupper are provided to have flexibility of the device. When the thintransistor array/organic emitting diode array and the touch electrodearray are formed, birefringence may occur at the upper plastic basesubstrate along the optical path. As a result, reflected external lightmay not be completely blocked by the absorption axis of the circularpolarizing plate due to its twisted optical path. According to anembodiment of the present invention, the upper plastic base substrate isremoved to expose the thin separation layer and the cover film, or thecircular polarizing plate is directly attached to the separation layer.Namely, unintended birefringence and reflection caused by an upperplastic and/or glass base substrate in the device may be reduced orprevented, and luminousness may be improved due to reduced visibility ofreflected external light.

Second, the thick upper plastic base substrate is removed from theorganic light emitting diode array, and flexibility and sliminess of theflexible display device can thus be improved.

It will be apparent to those skilled in the art that variousmodifications and variations can be made in the present inventionwithout departing from the spirit or scope of the inventions. Thus, itis intended that the present invention covers the modifications andvariations of this invention provided they come within the scope of theappended claims and their equivalents.

What is claimed is:
 1. An organic light emitting display devicecomprising: an organic light emitting panel comprising a thin filmtransistor array on a base substrate, an organic light emitting diodearray electrically connected to the thin transistor array, and anencapsulation layer covering the organic light emitting diode array; afirst adhesive layer on the organic light emitting panel; a touchelectrode array being in contact with the first adhesive layer; aseparation layer on the touch electrode array; and a cover film on theseparation layer.
 2. The organic light emitting display device accordingto claim 1, wherein the separation layer has a thickness of 100 Å orless.
 3. The organic light emitting display device according to claim 2,wherein the separation layer includes a silicon material or a metaloxide layer.
 4. The organic light emitting display device according toclaim 1, further comprising a barrier layer in contact with the touchelectrode array and a buffer layer in contact with the buffer layer,between the touch electrode array and the separation layer.
 5. Theorganic light emitting display device according to claim 4, wherein thebarrier layer includes an inorganic layer having a thickness of 500 Å to3,000 Å, and the buffer layer includes an organic layer having athickness of 1 μm to 8 μm.
 6. The organic light emitting display deviceaccording to claim 5, wherein the barrier layer includes a single layerof an oxide layer or a nitride layer, multi-layers of an oxide layer ora nitride layer, or an alternately laminated layer of an oxide layer anda nitride layer.
 7. The organic light emitting display device accordingto claim 5, wherein the buffer layer includes at least one of an acrylicgroup, an epoxy group, a polyimide group, and a polyamide group.
 8. Theorganic light emitting display device according to claim 1, wherein thecover film includes a circular polarizing plate.
 9. The organic lightemitting display device according to claim 8, wherein the circularpolarizing plate is in contact with the separation layer.
 10. Theorganic light emitting display device according to claim 1, furthercomprising a second adhesive layer between the separation layer and thecover film.
 11. The organic light emitting display device according toclaim 10, wherein the separation layer and the cover film are in contactwith a lower surface and an upper surface of the second adhesive layer,respectively.
 12. The organic light emitting display device according toclaim 10, further comprising a circular polarizing plate between thesecond adhesive layer and the cover film.
 13. The organic light emittingdisplay device according to claim 4, wherein the touch electrode arraycomprises: a plurality of first and second touch electrodes intersectingeach other; a protective layer covering the first and second touchelectrodes; a plurality of touch pad electrodes corresponding to thefirst and second electrodes at an outside region of an active region;and a plurality of routing wires transmitting signals to the first andsecond touch electrodes from the touch pad electrodes at the outsideregion of the active region, wherein, at least one of the first andsecond touch electrodes, the routing wires, and the touch pad electrodesis in contact with the barrier layer, and the protective layer is incontact with the first adhesive layer.
 14. The organic light emittingdisplay device according to claim 13, further comprising a lightshielding layer between the barrier layer and the protective layerwithin the touch electrode array, and the light shielding layercomprising a color filter layer and a black matrix layer stacked.
 15. Amethod of manufacturing an organic light emitting display devicecomprising: providing an organic light emitting panel comprising a thintransistor array on a first base substrate, an organic light emittingdiode array electrically connected to the thin transistor array, and anencapsulation layer covering the organic light emitting diode array;forming a separation layer and a touch electrode array on a second basesubstrate; attaching a first adhesive layer between the encapsulationlayer and the touch electrode array which face each other; exposing theseparation layer to remove the second base substrate; and attaching acover film to the exposed separation layer through a second adhesivelayer.
 16. The method of manufacturing the organic light emittingdisplay device according to claim 15, wherein removing the second basesubstrate includes irradiating a laser.
 17. The method of manufacturingthe organic light emitting display device according to claim 15, furthercomprising removing the separation layer to a certain thickness.
 18. Themethod of manufacturing the organic light emitting display deviceaccording to claim 17, wherein the remaining separation layer has athickness of 100 Å, or less after removing the separation layer to thecertain thickness.
 19. The method of manufacturing the organic lightemitting display device according to claim 15, further comprisingsequentially forming a buffer layer and a barrier layer on theseparation layer, after forming the separation layer and before formingthe touch electrode array.
 20. The method of manufacturing the organiclight emitting display device according to claim 15, wherein the secondbase substrate includes a plastic substrate or a glass substrate, or astacked structure of a plurality of plastic layers.
 21. A method ofmanufacturing an organic light emitting display device comprising:providing an organic light emitting panel comprising a thin transistorarray on a base substrate, an organic light emitting diode arrayelectrically connected to the thin transistor array, and anencapsulation layer covering the organic light emitting diode array;sequentially forming a separation layer, a buffer layer, a barrier layerand a touch electrode array on a glass substrate; attaching a firstadhesive layer between the encapsulation layer and the touch electrodearray, which face each other; removing the glass substrate and theseparation layer; and attaching a cover film to the exposed buffer layerthrough a second adhesive layer.